AMD revealed its 2027 product roadmap including Verano CPU, Instinct MI500X GPU, and next-generation AI rack architecture.

AMD is accelerating its CPU, GPU, and AI rack-scale solutions roadmaps to a yearly cadence, announcing plans to introduce its all-new EPYC 'Verano' CPU, Instinct MI500-series accelerators, and next-generation rack-scale AI solution in 2027. At its Advancing AI event, AMD CEO Lisa Su stated, "We are already deep in the development of our 2027 rack-scale solution that will push the envelope even further on performance efficiency and scalability with our next generation Verano CPUs and Instinct MI500X-series GPUs."

AMD's 2026 rack-scale AI roadmap centers on the Helios system, which will be based on AMD's 256-core EPYC 'Venice' processor expected to deliver a 70% generation-to-generation performance improvement. The platform will feature Instinct MI400X-series accelerators projected to double AI inference performance compared to the Instinct MI355X, alongside Pensando 'Vulcano' 800 GbE network cards compliant with the UEC 1.0 specification.

AMD's second-generation rack-scale system, arriving in 2027, will be powered by EPYC 'Verano' processors, Instinct MI500X-series accelerators, and Pensando 'Vulcano' 800 GbE NICs. While AMD has not disclosed specifications or performance numbers for its 2027 products, imagery suggests the post-Helios system will feature more compute blades to boost performance density, positioning it to compete with Nvidia's NVL576 'Kyber' system based on 144 Rubin Ultra packages.

AMD's timing aligns with TSMC's planned rollout of its A16 process technology in late 2026, the company's first production node to offer backside power delivery—a technology particularly valuable for heavy-duty datacenter CPUs and GPUs. While unconfirmed, AMD's 2027 processors and accelerators could leverage TSMC's advanced A16 process node.